Electronic carrier board and package structure thereof

ABSTRACT

An electronic carrier board and a package structure thereof are provided. The electronic carrier board includes a carrier, at least one pair of bond pads formed on the carrier, and a protective layer covering the carrier. The protective layer is formed with openings for exposing the bond pads. A groove is formed between the paired bond pads and has a length larger than a width of an electronic component mounted on the paired bond pads. The groove is adjacent to one of the paired bond pads and communicates with a corresponding one of the openings where this bond pad is exposed. Accordingly, a clearance between the electronic component and the electronic carrier board can be effectively filled with an insulating resin for encapsulating the electronic component, thereby preventing voids and undesirable electrical bridging between the paired bond pads from occurrence.

CROSS-REFERENCE TO RELATED APPLICATION(S)

This application is a divisional of copending application U.S. Ser. No.11/643,147, filed on Dec. 20, 2006.

FIELD OF THE INVENTION

The present invention relates to electronic carrier boards and packagestructures thereof, and more particularly, to an electronic carrierboard applicable to surface mounted technology (SMT), and a packagestructure of the electronic carrier board.

BACKGROUND OF THE INVENTION

Electronic components have been continuously designed and fabricated tohave a miniaturized profile in response to the progress of integratedcircuit (IC) manufacturing technology, and with provision of large-scaleand highly integrated electronic circuits, IC-based products haverelatively complete functionality.

Conventionally, electronic components are mounted on an electroniccarrier board (such as a printed circuit board (PCB), a circuit board,or a substrate) by through hole technology (THT). The electroniccomponents used in the THT, as not able to be further reduced in size,are considered occupying a significant amount of space on the electroniccarrier board. By the THT, the electronic carrier board needs to havethrough holes corresponding to pins of the electronic components, suchthat the electronic components with the pins coupled to the throughholes of the electronic carrier board actually occupy space on bothsides of the electronic carrier board, and further, solder joints formedat junctions of the electronic components and the electronic carrierboard are relatively large. Due to these drawbacks, the THT is no longerused in the mounting process of electronic components, but instead,surface mounted technology (SMT) becomes widely employed nowadays toeffectively mount electronic components on an electronic carrier board.

Using the SMT to mount electronic components, electrical connection ends(pins) of the electronic components are bonded to a surface of anelectronic carrier board on which the electronic components are mounted,such that there is no need to form plenty of through holes in theelectronic carrier board for accommodating the pins of the electroniccomponents as in the case of using the THT. Further by the SMT, theelectronic components can be disposed on both sides of the electroniccarrier board, thereby greatly improving space utilization of theelectronic carrier board. Compared with the electronic components usedin the THT, the electronic components used in the SMT have smaller sizessuch that more of these electronic components can be mounted on theelectronic carrier board by the SMT, and also, the electronic componentsused in the SMT are more cost-effectively fabricated. These advantagesmake the SMT become the main technology for mounting electroniccomponents on an electronic carrier board.

The SMT is further advantageous in view of the following aspects. As itbecomes necessary to mount passive components (such as capacitors,resistors or inductors) on an electronic carrier board to maintainstable electrical quality of an electronic product, and the electronicproduct is being made compact in size and with low consumption of power,the THT using relatively large electronic components is not consideredsuitable and is gradually replaced by the SMT. This is because in theTHT, through holes need to be formed in a circuit board to accommodatethe pins of the electronic components and are spaced apart from eachother by a distance corresponding to a pitch between the pins, and theelectronic components with the pins coupled to the through holes occupyboth sides of the circuit board, thereby leading to unsatisfactory spaceutilization of the circuit board. The SMT however does not have suchdrawbacks.

FIG. 1A shows a passive components mounted on a substrate by the SMT. Asshown, a pair of separate bond pads 12 are formed at predeterminedpositions on a substrate 11, and are exposed from a solder mask layer 13covering the substrate 11. Each of the exposed bond pads 12 is a soldermask defined (SMD) bond pad whose periphery is covered by the soldermask layer 13 or a non-solder mask defined (NSMD) bond pad which iscompletely exposed from the solder mask layer 13. FIG. 1A is illustratedwith solder mask defined (SMD) bond pads. With an appropriate amount ofsolder paste 15 being applied on the bond pads 12, two end portions of apassive component 14 can be bonded to the solder paste 15 and thensubjected to a reflow soldering process, such that the passive component14 is electrically connected to the bond pads 12 by means of the solderpaste 15. In order to avoid a tombstone effect due to uneven amounts ofthe solder paste 15 applied to the two end portions of the passivecomponent 14, openings of the solder mask layer 13 where the pair ofbond pads 12 are exposed are made symmetrical in shape and equal in sizeso as to provide the solder paste 15 with same wetting areas on the bondpads 12.

However, for a semiconductor package, it is found difficult toaccurately control the height of the passive component 14 bonded to thesolder paste 15 due to the amount of the solder paste 15 being used andmelting of the solder paste 15 in the reflow soldering process. In casethe solder mask layer 13 does not have a flat surface but is usuallyformed with recesses, a clearance 17 may be generated between thepassive component 14 and the solder mask layer 13. The height of theclearance 17 is merely 10 to 30 μm, which is smaller than the size(about 50 μm) of fillers of an epoxy molding compound (EMC) used forencapsulating the passive component 14. As such, in a molding process,the clearance 17 cannot be completely filled with the EMC, and thusvoids are formed. The voids result in a popcorn effect in a subsequenthigh-temperature operating environment, which undesirably damages thewhole package structure. Furthermore, the melting solder paste 15 mayflow into the clearance 17 (by a capillary action) and lead toundesirable electrical bridging and short circuit of the passivecomponent 14 (as shown in FIG. 1B), thereby adversely affecting theyield of the fabricated package structure.

Accordingly, as shown in FIG. 2, Taiwan Patent No. 442934 discloses amethod for mounting a passive component, which uses an electricallyinsulating material 28 such as epoxy resin to fill any possibleclearance between a passive component 24 and a substrate 21 on which thepassive component 24 is mounted, so as to avoid voids formed in theclearance and prevent a popcorn effect and electrical bridging of thepassive component 24. However, such method undesirably increases thefabrication processes and cost.

U.S. Pat. No. 6,521,997 provides another solution by additionallyforming a groove 330 in a solder mask layer 33 and between openings ofthe solder mask layer 33 where a pair of bond pads 32 are exposed, asshown in FIG. 3, so as to enlarge the clearance to allow the EMC to passthrough the clearance by means of the groove 330.

However, the size of the groove 330 is limited by the low resolution ofthe photosensitive solder mask layer 33, such that the smallest width ofthe groove that can be formed is 150 μm. Moreover, owing to thelimitation in photomask alignment precision of the openings throughwhich the bond pads are exposed, the minimum width M of the solder masklayer formed at an edge of each bond pad and around the correspondingopening is 75 μm. This thereby makes it more difficult to form thegroove between the bond pads when the component size is being reduced.

The dimensions (e.g. length and width) of a passive component arecurrently presented by two 2-digit numbers in the semiconductorindustry, for example, 0603-type or 0402-type passive component, whereinboth the length and width are typically measured in British unit (suchas inch), and generally the first 2-digit number presents the largerdimension (i.e. length) followed by the second 2-digit numberrepresenting the smaller dimension (i.e. width). Taking the 0402-typepassive component as an example, 0402 means the passive component havingspecific dimensions of 0.040 inch (length)×0.020 inch (width), which ifbeing converted into SI unit, correspond to a length of 0.040×25.4=1.016mm (approximately 1000 μm) and a width of 0.020×25.4=0.508 mm(approximately 500 μm). The 0402-type passive component usually has aheight of 500 μm, which can be a chip capacitor, resistor or inductor.

Since semiconductor devices are being made with light weight and compactprofile, a thin and fine ball grid array (TFBGA) semiconductor packagehas been downsized to have the thickness of an encapsulant reduced to530 μm. Thus, the 0402-type chip passive component having a height of500 μm becomes unable to be accommodated in such thin semiconductorpackage, but a smaller 0201-type chip passive component should be usedinstead so as to reduce the overall thickness of the package structure.The length, width and height of the 0201-type chip passive component arehalf of those of the 0402-type chip passive component, that is, the0201-type chip passive component is of 500 μm (length)×250 μm(width)×250 μm (height). In light of the length (500 μm) of the small0201-type chip passive component, spacing (A1), as shown in FIG. 4,between two paired bond pads on a substrate has to be decreased from 400μm to 250 μm.

As described above, the solder mask layer is typically made of aphotosensitive material, and due to the low photosensitive resolutionand the limitation in photomask alignment precision of openings, thesolder mask layer formed at the edge of each bond pad and around thecorresponding opening must be at least 75 μm wide. If the technologydisclosed in U.S. Pat. No. 6,521,997 of forming a 150 μm-wide groove inthe solder mask layers and between the paired bond pads is applied, asshown in FIG. 4, the width A2 of the solder mask layer formed at theedge of each bond pad and around the corresponding opening becomesmerely (250−150)/2=50 μm, which is smaller than the minimum width of 75μm as required and thus goes beyond the capability of currenttechnology.

Therefore, the problem to be solved is to provide an electronic carrierboard, which can prevent voids and electrical bridging caused by aclearance present between the electronic carrier board and an electroniccomponent mounted thereon, as well as allow small electronic componentsto be mounted on the electronic carrier board by SMT and the currentprocess equipment and conditions.

SUMMARY OF THE INVENTION

In view of the above drawbacks of the prior art, a primary objective ofthe present invention is to provide an electronic carrier board and apackage structure thereof, which allow an epoxy molding compound (EMC)to fill a space between the electronic carrier board and an electroniccomponent mounted thereon, so as to prevent voids and electricalbridging from occurrence.

Another objective of the present invention is to provide an electroniccarrier board and a package structure thereof, which allow a 0201-typechip passive component to be mounted on the electronic carrier boardwithout having the problems of voids, a popcorn effect and electricalbridging.

Still another objective of the present invention is to provide anelectronic carrier board and a package structure thereof, which allow a0201-type chip passive component or an even smaller passive component tobe mounted on the electronic carrier board by SMT without having theproblem of an EMC failing to flow through a space between the electroniccarrier board and the passive component.

A further objective of the present invention is to provide an electroniccarrier board and a package structure thereof, which allow a 0201-typechip passive component or an even smaller passive component to be bondedon the electronic carrier board without having the problem of processfailure due to the low resolution of a solder mask layer applied on theelectronic carrier board.

A further objective of the present invention is to provide an electroniccarrier board and a package structure thereof, so as to prevent atombstone effect from occurrence when an electronic component is mountedon the electronic carrier board.

In order to achieve the above and other objectives, the presentinvention proposes an electronic carrier board comprising: a carrier, atleast one pair of bond pads formed on a surface of the carrier, and aprotective layer covering the surface of the carrier. The protectivelayer is formed with openings through which the bond pads are exposed. Agroove is formed between the paired bond pads and has a length largerthan a width of an electronic component to be mounted on the paired bondpads. The groove is adjacent to one of the paired bond pads andcommunicates with a corresponding one of the openings where the one ofthe paired bond pads is exposed. The length of the groove can be largerthan or equal to a size of the corresponding one of the openings. Theone of the paired bond pads at least partially abuts against the groove,or does not abut against the groove. The electronic carrier board can bea substrate, a circuit board or a printed circuit board. The protectivelayer can be a solder mask layer. The electronic component can be apassive component. The protective layer covers a peripheral portion ofat least one of the bond pads, with a central portion of this bond padbeing exposed, thereby making this bond pad formed as a solder maskdefined (SMD) bond pad. Alternatively, at least one of the bond pads canbe completely exposed from the protective layer, such that this bond padis in the form of a non-solder mask defined (NSMD) bond pad. Moreover,the paired bond pads have equal areas exposed through the openings ofthe protective layer, so as to prevent a tombstone effect when theelectronic component is mounted on the electronic carrier board.

In a preferred embodiment, the electronic carrier board comprises acarrier, a plurality of pairs of bond pads formed on a surface of thecarrier, and a protective layer covering the surface of the carrier. Theprotective layer is formed with a plurality of openings through whichthe paired bond pads are exposed, such that a plurality of electroniccomponents can be mounted side by side on the paired bond pads. A grooveis formed between the paired bond pads and has a length larger than aspanning distance of the electronic components mounted side by side onthe paired bond pads. The groove is adjacent to one row of the pairedbond pads and communicates with corresponding ones of the openings wherethe one row of the paired bond pads are exposed.

In another preferred embodiment, the electronic carrier board comprisesa carrier, a plurality of pairs of bond pads formed in two rows on asurface of the carrier, and a protective layer covering the surface ofthe carrier. The protective layer is formed with a plurality of openingsthrough which the paired bond pads are exposed, such that a largepassive component, which comprises a plurality of component unitsconnected in parallel or in series, can be mounted on the two rows ofthe bond pads. A groove is formed between the two rows of the bond padsand has a length larger than a width of the passive component. Thegroove is adjacent to one of the two rows of the bond pads andcommunicates with corresponding ones of the openings where the one ofthe two rows of the bond pads are exposed.

The present invention also discloses a package structure of the aboveelectronic carrier board, comprising the electronic carrier board, anelectronic component, and an insulating resin. The electronic carrierboard comprises a carrier, at least one pair of bond pads formed on asurface of the carrier, and a protective layer covering the surface ofthe carrier. The protective layer is formed with openings through whichthe paired bond pads are exposed. A groove is formed between the pairedbond pads. The groove is adjacent to one of the paired bond pads andcommunicates with a corresponding one of the openings where the one ofthe paired bond pads is exposed. The electronic component is mounted onand electrically connected to the paired bond pairs exposed through theopenings, wherein the groove has a length larger than a width of theelectronic component. The insulating resin, such as an epoxy moldingcompound (EMC), encapsulates the electronic component and fills aclearance between the electronic component and the electronic carrierboard.

The present invention also discloses a bond pad structure, which iscovered by a protective layer, wherein the protective layer is formedwith an opening through which the bond pad is partially exposed, and theopening communicates with a groove having a length larger than a size ofthe opening. The bond pad can at least partially abut against the grooveor does not abut against the groove.

Compared with the prior art, the electronic carrier board and thepackage structure thereof in the present invention have a groove formedbetween at least one pair of bond pads provided on the electroniccarrier board. The groove is adjacent to one of the paired bond pads,and communicates with an opening of a solder mask layer (or a protectivelayer) through which this bond pad is exposed. By such arrangement,within the capability of resolution of the solder mask layer, a spacecapable of accommodating an EMC is formed between the paired bond pads,such that the EMC can effectively fill a clearance between theelectronic carrier board and an electronic component mounted thereon,and a void-induced popcorn effect and undesirable electrical bridgingare prevented.

By the above arrangement, even if a compact electronic component, suchas a 0201-type chip passive component, is mounted on the electroniccarrier board, the EMC can still effectively fill the clearance betweensuch electronic component and the electronic carrier board under thecurrent process conditions, thereby preventing a popcorn effect andelectrical bridging from occurrence. As such, the groove located underthe electronic component can be formed using the current processequipment and allows the EMC to smoothly flow under the electroniccomponent, such that voids and a subsequent popcorn effect are avoided.Further, the EMC filling the groove serves as an electrically insulatingshield between the paired bond pads, thereby preventing undesirableelectrical bridging between the paired bond pads.

Moreover in the present invention, exposed areas of the paired bond padsmay be made equal to each other, such that same wetting areas areprovided for the electronic component mounted on the bond pads by meansof solder paste and surface mounted technology (SMT), and thus atombstone effect can be avoided. Alternatively, bond pads havingdifferent surface areas can be used but are allowed to have equal areasexposed from the protective layer so as to provide same wetting areasfor bonding the electronic component.

BRIEF DESCRIPTION OF THE DRAWINGS

The present invention can be more fully understood by reading thefollowing detailed description of the preferred embodiments, withreference made to the accompanying drawings, wherein:

FIGS. 1A and 1B (PRIOR ART) are schematic diagrams showing a passivecomponent mounted on a substrate by SMT conventionally;

FIG. 2 (PRIOR ART) is a schematic diagram showing a passive componentmounted on a substrate as disclosed in Taiwanese Patent No. 442934;

FIG. 3 (PRIOR ART) is a schematic diagram showing mounting of a passivecomponent as disclosed in U.S. Pat. No. 6,521,997;

FIG. 4 (PRIOR ART) is a schematic diagram showing a 0201-type chippassive component bonded to a substrate conventionally;

FIG. 5A is a plan view of an electronic carrier board according to afirst preferred embodiment of the present invention;

FIGS. 5B and 5C are respectively a cross-sectional view and a plan viewshowing a package structure of the electronic carrier board mounted withan electronic component thereon according to the first preferredembodiment of the present invention;

FIG. 6A is a plan view of an electronic carrier board according to asecond preferred embodiment of the present invention;

FIG. 6B is a cross-sectional view showing a package structure of theelectronic carrier board mounted with an electronic component thereonaccording to the second preferred embodiment of the present invention;

FIG. 7A is a plan view of an electronic carrier board according to athird preferred embodiment of the present invention;

FIG. 7B is a cross-sectional view showing a package structure of theelectronic carrier board mounted with an electronic component thereonaccording to the third preferred embodiment of the present invention;

FIG. 8A is a plan view of an electronic carrier board according to afourth preferred embodiment of the present invention;

FIG. 8B is a cross-sectional view showing a package structure of theelectronic carrier board mounted with an electronic component thereonaccording to the fourth preferred embodiment of the present invention;

FIG. 9A is a plan view of an electronic carrier board according to afifth preferred embodiment of the present invention;

FIG. 9B is a cross-sectional view showing a package structure of theelectronic carrier board mounted with an electronic component thereonaccording to the fifth preferred embodiment of the present invention;

FIG. 10 is a plan view of an electronic carrier board according to asixth preferred embodiment of the present invention;

FIG. 11 is a plan view of an electronic carrier board according to aseventh preferred embodiment of the present invention;

FIG. 12 is a plan view of an electronic carrier board according to aneighth preferred embodiment of the present invention;

FIG. 13 is a plan view of an electronic carrier board according to aninth preferred embodiment of the present invention; and

FIG. 14 is a plan view of an electronic carrier board according to atenth preferred embodiment of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

Preferred embodiments of an electronic carrier board and a packagestructure thereof as proposed in the present invention are described asfollows with reference to FIGS. 5 to 14. It should be understood thatthe drawings are simplified schematic diagrams only showing the elementsrelevant to the present invention, and the layout of elements could bemore complicated in practical implementation.

First Preferred Embodiment

FIG. 5A shows an electronic carrier board 51 according to a firstpreferred embodiment of the present invention, and FIGS. 5B and 5C showa package structure of the electronic carrier board 51 mounted with anelectronic component 55 thereon.

As shown in FIG. 5A, the electronic carrier board 51 comprises: acarrier 511; at least one pair of bond pads 52 formed on a surface ofthe carrier 511; and a protective layer 53 covering the surface of thecarrier 511. The protective layer 53 is formed with openings 530, 530′through which the bond pads 52 are exposed. An elliptic groove 54 isformed between the paired bond pads 52 and is not covered by theprotective layer 53. The groove 54 has a length larger than a width ofan electronic component to be bonded to the paired bond pads 52, and isadjacent to one of the paired bond pads 52 (e.g. the left bond pad 52)and communicates with the corresponding opening 530′. In thisembodiment, the groove 54 abuts against the left bond pad 52.

The electronic carrier board 51 can be a package substrate for chippackaging, a circuit board, or a printed circuit board. In thisembodiment, the package substrate is illustrated. The carrier 511 of theelectronic carrier board 51 can be an insulating layer, or an insulatinglayer with stacked circuit layers therein, and a plurality of conductivecircuits (not shown) and the bond pads 52 are disposed on the carrier511. The insulating layer can be made of glass fiber, epoxy resin,polyimide tape, FR4 resin, or bismaleimide triazine (BT) resin, and thecircuit layers can be copper layers.

The carrier 511 of the electronic carrier board 51 is covered with theprotective layer 53 that protects the conductive circuits againstexternal damage and contamination. The protective layer 53 can be asolder mask layer made of a polymer with high fluidity, such as epoxyresin. The openings 530, 530′ of the protective layer 53 are formed atpositions corresponding to the bond pads 52 such that the bond pads 52are exposed from the openings 530, 530′. In this embodiment, the bondpads 52 exposed from the protective layer 53 can be solder mask defined(SMD) bond pads whose peripheral portions are covered by the solder masklayer (the protective layer 53).

Besides the elliptic shape, the groove 54 disposed between the pairedbond pads 52 may also have any other shape that makes the length of thegroove 54 larger than the width of the electronic component to be bondedto the bond pads 52.

As shown in FIGS. 5B and 5C, the package structure of the electroniccarrier board 51 is provided, which comprises: the electronic carrierboard 51, an electronic component 55, and an insulating resin such as anepoxy molding compound (EMC) 57. The electronic carrier board 51comprises: the carrier 511; the at least one pair of bond pads 52 formedon the carrier 511; the protective layer 53 covering the carrier 511,wherein the protective layer 53 is formed with the openings 530, 530′for exposing the bond pads 52; and the groove 54 formed between thepaired bond pads 52 and having a length L larger than a width W of theelectronic component 55, wherein the groove 54 is adjacent to one of thepaired bond pads 52 (e.g. the left bond pad 52) and communicates withthe corresponding opening 530′. The electronic component 55 is mountedon the electronic carrier board 51 and bonded to the bond pads 52exposed through the openings 530, 530′. The EMC 57 encapsulates theelectronic component 55 and fills a clearance between the electroniccomponent 55 and the electronic carrier board 51.

After a conductive material such as solder paste 56 is applied on thebond pads 52, two end portions of the electronic component 55 can bemounted to the solder paste 56 and then a reflow soldering process isperformed, such that the electronic component 55 is bonded andelectrically connected to the bond pads 52 by means of the solder paste56. The electronic component 55 can be a passive component, such as a0201-type chip passive component and an even smaller chip passivecomponent. In this embodiment, the 0201-type chip passive component isillustrated. As shown in FIGS. 5B and 5C, in order to mount the0201-type chip passive component on the electronic carrier board 51, adistance S1 between the two exposed paired bond pads 52 is set to 250μm, and owing to the resolution limit of the solder mask layer (theprotective layer 53), a width S3 of the groove 54 is at least 150 μm.Thus, the solder mask layer (the protective layer 53), which is formedat an edge of the bond pad 52 (not adjacent to the groove 54) and aroundthe opening 530, i.e. formed between the groove 54 and the opening 530,has a width S2 of 100 μm (250 μm−150 μm=100 μm), which is much largerthan the minimum width of 75 μm (as discussed in the Background)considered as a limit. Therefore, during a molding process performed ona package substrate mounted with the 0201-type chip passive component,the EMC 57 with fluidity, such as epoxy resin, used for encapsulatingthe passive component can effectively flow into a space formed by thegroove 54 and the opening 530′ so as to fill a clearance between the0201-type chip passive component and the package substrate. As a result,voids and a popcorn effect in a subsequent thermal environment areprevented, and the EMC filling the groove provides an electricallyinsulating shielding effect between the paired bond pads such thatundesirable electrical bridging between the paired bond pads can beavoided.

Compared with the prior art, the electronic carrier board and thepackage structure thereof in the present invention have a groove formedbetween a pair of bond pads provided on the electronic carrier board.The groove has a length larger than a width of an electronic componentmounted on the electronic carrier board. The groove is adjacent to oneof the paired bond pads, and communicates with an opening of a soldermask layer through which this bond pad is exposed. By such arrangement,the solder mask layer formed at an edge of the other one of the pairedbond pads may have a width not smaller than the limit of 75 μm and alsoa space capable of accommodating an EMC is formed between the pairedbond pads, such that the EMC can effectively fill a clearance betweenthe electronic carrier board and the electronic component mountedthereon, and a void-induced popcorn effect and undesirable electricalbridging are prevented.

By the above arrangement, even if a compact electronic component, suchas a 0201-type chip passive component, is mounted on the electroniccarrier board, the EMC can still effectively fill the clearance betweensuch electronic component and the electronic carrier board under thecurrent process condition of having the limit of 75 μm in width of thesolder mask layer formed at the edge of the bond pad, thereby preventinga popcorn effect and electrical bridging from occurrence. As such, thegroove located under the electronic component can be formed using thecurrent process equipment and allows the EMC to smoothly flow under theelectronic component, such that voids and a subsequent popcorn effectare avoided. Further, the EMC filling the groove serves as anelectrically insulating shield between the paired bond pads, therebypreventing electrical bridging between the paired bond pads.

Moreover in the present invention, exposed areas of the paired bond padsmay be made equal to each other, such that same wetting areas areprovided for the electronic component mounted on the bond pads by meansof solder paste and surface mounted technology (SMT), and thus atombstone effect can be avoided.

Second Preferred Embodiment

FIGS. 6A and 6B show an electronic carrier board 51 according to asecond preferred embodiment of the present invention and a packagestructure of the electronic carrier board 51 mounted with an electroniccomponent 55 thereon.

The electronic carrier board 51 and the package structure thereof in thesecond embodiment are similar to those in the first embodiment, with adifference in that, in the second embodiment, the size of the openings530, 530′ formed in the protective layer 53 (the solder mask layer) islarger than the size of the bond pads 52, such that the bond pads 52 arecompletely exposed from the protective layer 53, thereby formingnon-solder mask defined (NSMD) bond pads 52, as shown in FIGS. 6A and6B.

Further as shown in FIG. 6A, a distance S1 between the exposed bond pads52 is 250 μm, a distance S4 between an edge of the opening 530 and acorresponding edge of the NSMD bond pad 52 exposed through the opening530 is 25 μm, and a width S3 of the groove 54 is at least 150 μm, suchthat a width S2 of the solder mask layer (the protective layer 53)disposed between the opening 530 and the groove 54 is still as large as75 μm (250 μm−25 μm−150 μm=75 μm). By such arrangement, when anelectronic component such as a 0201-type chip passive component ismounted on the electronic carrier board 51, the EMC 57 still caneffectively flow into the groove 54 and fill a clearance between theelectronic component 55 and the electronic carrier board 51.

Third Preferred Embodiment

FIGS. 7A and 7B show an electronic carrier board 51 according to a thirdpreferred embodiment of the present invention and a package structure ofthe electronic carrier board mounted with an electronic component 55thereon.

The electronic carrier board 51 and the package structure thereof in thethird embodiment are similar to those in the first embodiment, with aprimary difference in that, in the third embodiment, the groove 54 isrectangular in shape as shown in FIG. 7A.

It should be noted that in this embodiment, the bond pads 52 exposedfrom the protective layer 53 can be SMD bond pads or NSMD bond pads andthus are not limited to those shown in FIGS. 7A and 7B.

Fourth Preferred Embodiment

FIGS. 8A and 8B show an electronic carrier board according to a fourthpreferred embodiment of the present invention and a package structure ofthe electronic carrier board mounted with an electronic componentthereon.

As shown in FIGS. 8A and 8B, the electronic carrier board and thepackage structure thereof in the fourth embodiment are similar to thosein the third preferred embodiment, with a primary difference in that, inthe fourth embodiment, the opening 530 of the protective layer 53, whichdoes not communicate with the groove 54, has a size larger than that ofa corresponding one of the paired bond pads 52, making this bond pad 52completely exposed from the protective layer 53 and in the form of aNSMD bond pad. The other one of the paired bond pads 52 is partiallyexposed through the opening 530′ that communicates with the groove 54and thus is a SMD bond pad. The size of the opening 530 is also largerthan that of the opening 530′ that communicates with the groove 54, andthe size of the opening 530′ is equal to that of the NSMD bond pad 52completely exposed through the opening 530, such that the exposed bondpads 52 provide equal wetting areas for the electronic component bondedthereto.

Fifth Preferred Embodiment

FIGS. 9A and 9B show an electronic carrier board according to a fifthpreferred embodiment of the present invention and a package structure ofthe electronic carrier board mounted with an electronic componentthereon.

As shown in FIGS. 9A and 9B, the electronic carrier board and thepackage structure thereof in the fifth embodiment are similar to thosein the third preferred embodiment, with a primary difference in that, inthe fifth embodiment, the opening 530′ communicating with the groove 54has a size larger than that of a corresponding one of the paired bondpads 52, making this bond pad 52 completely exposed from the protectivelayer 53 and in the form of a NSMD bond pad. The other one of the pairedbond pads 52 is partially exposed through the opening 530 and is a SMDbond pad.

The size of the opening 530′ is larger than that of the opening 530, andthe size of the opening 530 is equal to that of the NSMD bond pad 52completely exposed through the opening 530′, such that the exposed bondpads 52 provide equal wetting areas for the electronic component bondedthereto.

Sixth Preferred Embodiment

FIG. 10 shows an electronic carrier board 51 according to a sixthpreferred embodiment of the present invention.

As shown in FIG. 10, the electronic carrier board 51 of the sixthembodiment is similar to that of the third embodiment, with a primarydifference in that, in the sixth embodiment, the length of the groove 54formed between the paired bond pads 52 is larger than the width of anelectronic component to be mounted on the electronic carrier board 51and is equal to the size of the opening 530′ communicating with thegroove 54.

Seventh Preferred Embodiment

FIG. 11 shows an electronic carrier board 51 according to a seventhpreferred embodiment of the present invention.

As shown in FIG. 11, the electronic carrier board 51 of the seventhembodiment is similar to that of the third embodiment, with a primarydifference in that, in the seventh embodiment, in a situation having anappropriate bond pad spacing, the left one of the bond pads 52 is formedwith an extended portion that is exposed from the opening 530′ of theprotective layer 53 and partly abuts against the groove 54. A distance Dbetween the left the bond pad 52 and the groove 54, corresponding to awidth of the extended portion, is at least 75 μm, such that if thegroove 54 is shifted in position to the left, an exposed area of theleft bond pad 52 is not changed greatly and thus the subsequent wettingarea provided for bonding an electronic component is not affected.

Eighth Preferred Embodiment

FIG. 12 shows an electronic carrier board 51 according to an eighthpreferred embodiment of the present invention.

As shown in FIG. 12, the electronic carrier board 51 of the eighthembodiment is similar to that of the third embodiment, with a primarydifference in that, in the eighth embodiment, the left one of the bondpads 52 entirely does not abut against the groove 54, and a distance Dbetween the left bond pad 52 and the groove 54 is at least 75 μm, suchthat if the groove 54 is shifted in position to the left, an exposedarea of the left bond pad 52 is not changed and thus the subsequentwetting area provided for bonding an electronic component is notaffected.

Ninth Preferred Embodiment

FIG. 13 showing an electronic carrier board 51 according to a ninthpreferred embodiment of the present invention.

As shown in FIG. 13, the electronic carrier board 51 of the ninthembodiment is similar to that of the third embodiment, with a primarydifference in that, in the ninth embodiment, a plurality of pairs ofbond pads 52 are formed on the electronic carrier board 51 to allow aplurality of electronic components (not shown) to be each mounted on oneof the pairs of bond pads 52, such that the electronic components arebonded to the pairs of bond pads 52 in a side-by-side manner. Forexample, as shown in FIG. 13, the plurality of bond pads 52 are arrangedin two rows: the left row and the right row. A plurality of openings530, 530′ are formed in the protective layer 53 to expose the pluralityof bond pads 52 respectively. A groove 54 is formed between the left rowand the right row of the bond pads 52 and has a length larger than aspanning distance of the electronic components disposed on the bond pads52 side by side. The groove 54 is adjacent to the left row of bond pads52 and communicates with the openings 530′ through which the left row ofbond pads 52 are exposed. Accordingly, an EMC (not shown) forencapsulating the electronic components mounted on the bond pads 52 canflow into the groove 54 and fill a clearance between the electroniccomponents and the electronic carrier board 51, thereby preventing voidsand undesirable electrical bridging from occurrence.

Tenth Preferred Embodiment

FIG. 14 shows an electronic carrier board 51 according to a tenthpreferred embodiment of the present invention.

As shown in FIG. 14, the electronic carrier board 51 of the tenthembodiment is similar to that of the third embodiment, with a primarydifference in that, in the tenth embodiment, a plurality of pairs ofbond pads 52 are formed on the electronic carrier board 51 to allow alarge passive component, such as 0805-type passive component comprisinga plurality of component units (e.g. paired capacitors or resistors)connected in parallel or in series, to be mounted thereon. For example,as shown in FIG. 14, the plurality of bond pads 52 are arranged in tworows: the left row and the right row. A plurality of openings 530, 530′are formed in the protective layer 53 to expose the plurality of bondpads 52 respectively. A groove 54 is formed between the left row and theright row of the bond pads 52 and has a length larger than a width ofthe 0805-type passive component. The groove 54 is adjacent to the leftrow of bond pads 52 and communicates with the openings 530′ throughwhich the left row of bond pads 52 are exposed.

It should be noted that each of the above preferred embodiments of thepresent invention may be altered and modified in light of processrequirements and are not limited by the foregoing descriptions.

The invention has been described using exemplary preferred embodiments.However, it is to be understood that the scope of the invention is notlimited to the disclosed embodiments. On the contrary, it is intended tocover various modifications and similar arrangements. The scope of theclaims, therefore, should be accorded the broadest interpretation so asto encompass all such modifications and similar arrangements.

1. A package structure of an electronic carrier board, comprising: theelectronic carrier board comprising a carrier, at least one pair of bondpads formed on a surface of the carrier, and a protective layer coveringthe surface of the carrier, wherein the protective layer is formed withopenings through which the paired bond pads are exposed, and a groove inthe productive layer is formed between the paired bond pads and adjacentto one of the paired bond pads and communicates with a corresponding oneof the openings where the one of the paired bond pads is exposed; anelectronic component mounted on and electrically connected to the pairedbond pads exposed through the openings of the protective layer, whereinthe groove has a length larger than a width of the electronic component;and an insulating resin encapsulating the electronic component andfilling a clearance between the electronic component and the electroniccarrier board.
 2. The package structure of claim 1, wherein the lengthof the groove is larger than or equal to a size of the corresponding oneof the openings.
 3. The package structure of claim 1, wherein the one ofthe paired bond pads at least partially abuts against the groove or isfree of abutting against the groove.
 4. The package structure of claim3, wherein the one of the paired bond pads is free of abutting againstthe groove and is spaced apart from the groove by a distance of at least75 μm.
 5. The package structure of claim 1, wherein the electroniccarrier board is one of a package substrate for chip packaging, acircuit board, and a printed circuit board.
 6. The package structure ofclaim 1, wherein the carrier of the electronic carrier board is one ofan insulating layer, and an insulating layer with stacked circuit layerstherein.
 7. The package structure of claim 1, wherein at least one ofthe bond pads has a size larger than that of a corresponding one of theopenings, making the at least one bond pad formed as a solder maskdefined (SMD) bond pad, or at least one of the bond pads has a sizesmaller than that of a corresponding one of the openings, making the atleast one bond pad formed as a non-solder mask defined (NSMD) bond pads.8. The package structure of claim 1, wherein the paired bond pads arecoated with a conductive material thereon such that the electroniccomponent is mounted on and electrically connected to the bond pads bymeans of the conductive material.
 9. The package structure of claim 1,wherein the electronic component comprises a passive component.
 10. Thepackage structure of claim 1, wherein the paired bond pads have equalareas exposed through the openings of the protective layer.